Although materials that are firmly bonded together with epoxy and other adhesives are ubiquitous in modern life, from dental crowns to reinforced concrete, it is remarkably difficult to study. Now, a paper in the journal Proceedings of the National Academy of Sciences by Professors Oral Buyukozturk and Markus Buehler, doctoral student Denvid Lau (now an Assistant Professor at the City University of Hong Kong), and research associate Kurt Broderick of MIT’s Microsystems Technology Laboratories reveals the crucial role of moisture in setting the stage for failure. By looking at the molecular level, the group came up with an innovative method to measure the interface weakening as a result of exposure to environmental effects. Buyukozturk says, “I think this is going to be an important step toward assessment of the bonding, and enable us to design more durable composites.” Read the full MIT News Office story: https://newsoffice.mit.edu/2014/research-reveals-how-bonded-materials-los…