Future Leaders in CEE: From subsonic to supersonic: a site-specific study of single microparticle impact bonding

Future Leaders in CEE: From subsonic to supersonic: a site-specific study of single microparticle impact bonding

Speaker: Alade Ahmed Tiamiyu, MSc, PhD, EIT, Postdoctoral Research Fellow, DMSE, MIT From a humble background, the journey from the city of Lagos, Nigeria to Canada, and then, USA, will be discussed. I will highlight the unique challenges faced in the process leading to my current position and how I overcome them. The talk will be capped up by addressing Diversity and Inclusion from a small-scale family-model point of view. Cold spray is a fast-growing solid-state coating process with a high deposition rate that has been attracting industrial interest in the last decade. It involves the acceleration of solid powder particles at supersonic speed to impact and adhere to a substrate or previously deposited particles, forming coats. This unique technique is used to mitigate corrosion by depositing more noble materials of superior corrosion resistance on metallic substrates. It can also be used for in situ repairs of cracks, restoration/remanufacturing of unserviceable engineering/aeronautical components or corroded parts that are in service; making them reusable and in turn, save the cost of buying new products. For bonding to occur during cold spray, the impact velocity of the particle, must reach and exceed a critical velocity, and an intimate metal-metal clean contact must be achieved between the metal lattices. To expand the wide-spread application of cold spray to unconventional areas, the underlying mechanism of metal-metal bonding must be unearthed. Till date, the mechanism of bonding is under debate due to the difficulty in experimental observation of microparticle impacts that only span nanoseconds. In this talk, the major advances made in unravelling events that lead to bonding by studying single particle impacts from subsonic to supersonic regimes will be highlighted. Microstructural evolution at the particle-substrate interface will also be discussed.